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NZL5V6AXV3T1 Series
Preferred Devices
Dual Common Anode ESD Protection Diodes
SC-89 Package
These dual monolithic silicon ESD protection diodes are intended for use in voltage- and ESD-sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium.
Specification Features: http://onsemi.com
PIN 1. CATHODE 2. CATHODE 3. ANODE 1 3 2
* SC-89 Package Allows Either Two Separate Unidirectional * * * *
Configurations or a Single Bidirectional Configuration ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Meets IEC61000-4-2 Level 4 Low Leakage < 5.0 mA These are Pb-Free Devices
SC-89 CASE 463C STYLE 4
MARKING DIAGRAM
3 Lx 1 G M 2
G
Mechanical Characteristics: CASE: Void-free, Transfer-molded, Thermosetting Plastic Epoxy Meets UL 94, V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE:
L = Device Code x = Specific Device M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device NZL5V6AXV3T1 NZL5V6AXV3T1G NZL6V8AXV3T1 NZL6V8AXV3T1G NZL6V8AXV3T3G NZL7V5AXV3T1 NZL7V5AXV3T1G Package SC-89* SC-89* SC-89* SC-89* SC-89* SC-89* SC-89* Shipping 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 10000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel
260C Device Meets MSL 1 Requirements
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *This package is inherently Pb-Free.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the table on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2007
1
February, 2007 - Rev. 5
Publication Order Number: NZL5V6AXV3T1/D
NZL5V6AXV3T1 Series
MAXIMUM RATINGS
Rating Total Power Dissipation on FR-5 Board (Note 1) @ TA = 25C Derate above 25C Thermal Resistance Junction to Ambient Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) IEC61000-4-2 (Contact) Symbol PD RqJA TJ, Tstg TL Value 240 1.9 525 -55 to +150 260 10 Unit mW mW/C C/W C C kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-5 board with minimum recommended mounting pad. *Other voltages may be available upon request.
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol VRWM IR VBR IT IF VF Parameter Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF VC VBR VRWM IF
I
IR VF IT
V
IPP
Uni-Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max @ IF = 10 mA for all types) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
Breakdown Voltage IR @ VRWM mA 5.0 1.0 1.0 1.0 VC (V) @ IPP = 1.0 A Typ 7.0 7.9 7.9 8.8 Surge VC (V) @ Max IPP Max 10.1 11.9 11.9 13.5 4.8 6.7 6.7 5.7 Max IPP (A) Ppk (W) Typ 50 73 73 75
Device NZL5V6AXV3T1 NZL6V8AXV3T1 NZL6V8AXV3T3 NZL7V5AXV3T1
Device Marking L0 L2 L2 L3
VRWM V 3.0 4.5 4.5 5.0
VBR (Note 2) (V) Min 5.32 6.46 6.46 7.12 Nom 5.6 6.8 6.8 7.5 Max 5.88 7.14 7.14 7.88
@ IzT mA 5.0 5.0 5.0 5.0
2. VBR measured at pulse test current IT at an ambient temperature of 25C. Surge current waveform per Figure 5.
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2
NZL5V6AXV3T1 Series
TYPICAL CHARACTERISTICS
BREAKDOWN VOLTAGE (VOLTS) (VBR @ IT) 9.0 250
8.0
7V5
200
6V8 7.0
IR (nA)
150 5V6 100
6.0
5V6
6V8 50 0 -55 7V5
5.0 -55
-5
+ 45 + 95 TEMPERATURE (C)
+ 145
-5
+ 45 + 95 TEMPERATURE (C)
+ 145
Figure 1. Typical Breakdown Voltage versus Temperature
50 PD, POWER DISSIPATION (mW) 45 40 CAPACITANCE (pF) 35 30 5V6 25 20 15 10 5 0 0 0.4 0.8 1.2 1.6 2.0 6V8 7V5 300 250 200 150 100
Figure 2. Typical Leakage Current versus Temperature
FR-5 BOARD 50 0 0 25 50 75 100 125 TEMPERATURE (C) 150 175
VOLTAGE (V)
Figure 3. Typical Capacitance versus Bias Voltage
(Upper curve for each part is unidirectional mode, lower curve is bidirectional mode)
Figure 4. Steady State Power Derating Curve
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0 0
tr
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms
tP
20
40 t, TIME (ms)
60
80
Figure 5. 8 X 20 ms Pulse Waveform
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NZL5V6AXV3T1 Series
Figure 6. Positive 8 kV contact per IEC 6100-4-2 - NZL6V8AXV3T1G
Figure 7. Negative 8 kV contact per IEC 6100-4-2 - NZL6V8AXV3T1G
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NZL5V6AXV3T1 Series
TYPICAL COMMON ANODE APPLICATIONS A dual junction common anode design in an SC-89 package protects two separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below.
A KEYBOARD TERMINAL PRINTER ETC. B I/O C D FUNCTIONAL DECODER
GND NZLxxxAXV3T1
Figure 8. Computer Interface Protection
VDD VGG ADDRESS BUS
RAM
ROM
DATA BUS I/O CPU NZLxxxAXV3T1 CLOCK CONTROL BUS
GND NZLxxxAXV3T1
Figure 9. Microprocessor Protection
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NZL5V6AXV3T1 Series
PACKAGE DIMENSIONS
SC-89, 3-LEAD CASE 463C-03 ISSUE C
A -X-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C-01 OBSOLETE, NEW STANDARD 463C-02. MILLIMETERS MIN NOM MAX 1.50 1.60 1.70 0.75 0.85 0.95 0.60 0.70 0.80 0.23 0.28 0.33 0.50 BSC 0.53 REF 0.10 0.15 0.20 0.30 0.40 0.50 1.10 REF --- --- 10 _ --- --- 10 _ 1.50 1.60 1.70 INCHES NOM MAX 0.063 0.067 0.034 0.040 0.028 0.031 0.011 0.013 0.020 BSC 0.021 REF 0.004 0.006 0.008 0.012 0.016 0.020 0.043 REF --- --- 10 _ --- --- 10 _ 0.059 0.063 0.067 MIN 0.059 0.030 0.024 0.009
3 1 2
B -Y- S
K G
2 PL DIM A B C D G H J K L M N S
D 0.08 (0.003)
M
3 PL
XY
M C
N J -T-
SEATING PLANE
STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE
SOLDERING FOOTPRINT
H H
L
G RECOMMENDED PATTERN OF SOLDER PADS
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NZL5V6AXV3T1/D

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